Douglas C. Hopkins

Publications

1. Ye, Hua. Basaran, Cernai. Hopkins, Douglas C. Deformation of solder joint under current stressing and numerical simulation - II [Journal Article] International Journal of Solids & Structures. v 41 n 18-19 September 2004. p 4959-4973

2. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Deformation of solder joint under current stressing and numerical simulation - I [Journal Article] International Journal of Solids & Structures. v 41 n 18-19 September 2004. p 4939-4958

3. Ye, Hua. Basaran, Cernal. Hopkins, Douglas C. Frear, Barrel. Lin, Jong-Kai. Damage mechanics of microelectronics solder joints under high current densities [Conference Paper] Proceedings - Electronic Components and Technology Conference 2004 Proceedings - 54th Electronic Components and Technology Conference. v 1 2004. p 988-997

4. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Mechanical implications of high current densities in flip-chip solder joints [Journal Article] International Journal of Damage Mechanics. v 13 n 4 October 2004. p 335-345

5. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Failure Modes of Flip Chip Solder Joints under High Electric Current Stressing [Conference Paper] Proceedings of SPIE - The International Society for Optical Engineering 2003 International Symposium on Microelectronics. v 5288 2003. p 801-806

6. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing [Journal Article] International Journal of Solids & Structures. v 41 n 9-10 May 2004. p 2743-2755

7. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Mechanical degradation of microelectronics solder joints under current stressing [Journal Article] International Journal of Solids & Structures. v 40 n 26 December 2003. p 7269-7284

8. Ye, Hua. Hopkins, Douglas C. Basaran, Cemal. Measurement of high electrical current density effects in solder joints [Journal Article] Microelectronics & Reliability. v 43 n 12 December 2003. p 2021-2029

9. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines [Journal Article] IEEE Transactions on Components & Packaging Technologies. v 26 n 3 September 2003. p 673-681

10. Ye, Hua. Basaran, Cemal. Hopkins, Douglas C. Damage mechanics of microelectronics solder joints under high current densities [Journal Article] International Journal of Solids & Structures. v 40 n 15 July 2003. p 4021-4032

11. Ye, Hua. Hopkins, Douglas C. Basaran, Cemal. Measurement and effects of high electrical current stress in solder joints [Conference Paper] Proceedings of SPIE - The International Society for Optical Engineering. v 4931 2002. p 427-432

12. Hopkins, Douglas C. Moronski, James. Partitioning digitally programmable power-control for applications to ballasts [Conference Paper] Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC. v 2 2002. p 931-935 (IEEE cat n 02ch37335)

13. Jacobsen, John B. Hopkins, Douglas C. Optimally selecting packaging technologies and circuit partitions based on cost and performance [Conference Paper] Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC. v 1 2000. IEEE, Piscataway, NJ, USA. p 31-38